As demands for chips keep rising, the industry is calling for bigger wafers and higher yields. But the challenges of moving to 200mm wafers come from not only fabrication but also packaging and testing. In this video, Dr. Victor Veliadis from PowerAmerica explains factors to be mindful for when transferring from 150mm to 200mm wafers.
Dr. Veliadis is Executive Director and CTO of PowerAmerica, a WBG semiconductor power electronics Manufacturing Institute. He is also an ECE Professor at NCSU, an IEEE Fellow and EDS Distinguished Lecturer.